4 and 8-channel esd protection arrays in csp cm1220 ?2010 scillc. all rights reserved. publication order number: march 2010 ? rev.2 cm1220/d features ? four and eight channels of esd protection ? optiguard tm coated for improved reliability ? 15kv esd protection on each channel (iec 61000-4-2 level 4, contact discharge) ? 30kv esd protection on each channel (hbm) ? chip scale package (csp) features extremely low lead inductance for optimum esd protection ? 5 bump, 0.960mm x 1.330mm csp footprint for cm1220-04 ? 10 bump, 1.960mm x 1.330mm csp footprint for cm1220-08 ? rohs-compliant, lead-free version packaging applications ? lcd and camera data lines in mobile handsets ? i/o port protection for mobile handsets, notebook computers, pdas, etc. ? keypads and buttons ? wireless handsets ? handheld pcs/pdas ? lcd and camera modules functional description the cm1220 esd protection arrays are available in f our and eight channel configurations. each esd channel features a nominal capacitance of 14pf making the d evices ideal for protecting high speed i/o ports and lcd a nd camera data lines without significantly affecting s ignal integrity. the cm1220 integrates avalanche-type esd diodes on every channel, providing a very high leve l of protection for sensitive electronic components that may be subjected to electrostatic discharge (esd). these d iodes safely dissipate esd strikes of 15kv, exceeding th e maximum requirement of the iec61000-4-2 internation al standard. using the mil-std-883 (method 3015) specification for human body model (hbm) esd, the cm1220 protect against contact discharges at greate r than 30kv. these devices are particularly well-suited for port able electronics (e.g. wireless handsets, pdas, notebook computers) because of their small package and easy- to- use pin assignments. in particular, the cm1220 is i deal for protecting high speed i/o ports and data and contro l lines for the lcd display and camera interface in mobile handsets. the cm1220 incorporates cmd?s optiguard tm coating for improved reliability at assembly in a space-saving, low- profile chip scale package. block diagram
cm1220 rev.2 | page 2 of 10 | www.onsemi.com pin configurations top view (bumps down) cm1220-04 5-bump csp package with optiguard tm top view (bumps down) bottom view (bumps up) bottom view (bumps up) cm1220-08 10-bump csp package with optiguard tm note: 1). these drawings are not to scale.
cm1220 rev. 2 | page 3 of 10 | www.onsemi.com pin descriptions cm1220-08 cm1220-04 cm1220-08 cm1220-04 pins name pins name description pins name pins name description a1 esd1 a1 esd1 esd channel c1 esd5 c1 esd3 esd channel a3 esd2 a3 esd2 esd channel c3 esd6 c3 esd4 esd channel a5 esd3 ? ? esd channel c5 esd7 ? ? esd channel a7 esd4 ? ? esd channel c7 esd8 ? ? esd channel b2 gnd b2 gnd device ground b6 gnd ? ? device ground ordering information bumps package ordering part number 1 part marking 5 csp cm1220-04cp j 10 csp CM1220-08CP l208 note 1: parts are shipped in tape and reel form u nless otherwise specified. absolute maximum ratings parameter rating units storage temperature range -65 to +150 c standard operating conditions parameter rating units operating temperature range -40 to +85 c
cm1220 rev.2 | page 4 of 10 | www.onsemi.com electrical operating characteristics (see note 1) symbol parameter conditions min typ max units c diode diode (channel) capacitance at 2.5vdc reverse bias, 1mhz, 30mvac 11 14 17 pf v diode diode standoff voltage i diode = 10 a 6.0 v i leak diode leakage current v in = + 3.3v (reverse bias voltage) 0.1 1 a v sig signal clamp voltage positive clamp negative clamp i diode = 10ma 5.6 -1.5 6.8 -0.8 9.0 -0.4 v v v esd in-system esd withstand voltage a) human body model, mil-std-883, method 3015 b) contact discharge per iec 61000-4-2 note 2 30 15 kv kv r dyn dynamic resistance positive negative 2.3 0.9 note 1: t a =25 c unless otherwise specified. note 2: esd applied to input and output pins with r espect to gnd, one at a time. unused pins are left open. performance information diode characteristics (nominal conditions unless sp ecified otherwise) capacitance (normalized) figure 1. insertion loss vs. frequency (0v bias)
cm1220 rev. 2 | page 5 of 10 | www.onsemi.com application information parameter value pad size on pcb 0.240mm pad shape round pad definition non-solder mask defined pads solder mask opening 0.290mm round solder stencil thickness 0.125mm - 0.150mm solder stencil aperture opening (laser cut, 5% tape red walls) 0.300mm round solder flux ratio 50/50 by volume solder paste type no clean pad protective finish osp (entek cu plus 106a) tolerance ? edge to corner ball + 50 m solder ball side coplanarity + 20 m maximum dwell time above liquidous (183?c) 60 seconds maximum soldering temperature for lead-free devices using a lead-free solder paste 260c solder mask opening 0.290mm dia. non-solder mask defined pad 0.240mm dia. solder stencil opening 0.300mm dia. figure 2. recommended non-solder mask defined pad i llustration figure 3. lead-free (snagcu) solder ball reflow pro file
cm1220 rev.2 | page 6 of 10 | www.onsemi.com mechanical specifications the cm1220 is supplied in custom chip scale package s (csp) depending on the channel count. dimensions for these packages are presented in the following pages. cm1220-04cp mechanical specifications package specifications package custom csp bumps 5 millimeters inches dim min nom max min nom max a1 0.915 0.960 1.005 0.0360 0.0378 0.0396 a2 1.285 1.330 1.375 0.0506 0.0524 0.0541 b1 0.495 0.500 0.505 0.0195 0.0197 0.0199 b2 0.245 0.250 0.255 0.0096 0.0098 0.0100 b3 0.430 0.435 0.440 0.0169 0.0171 0.0173 b4 0.430 0.435 0.440 0.0169 0.0171 0.0173 c1 0.180 0.230 0.280 0.0071 0.0091 0.0110 c2 0.180 0.230 0.280 0.0071 0.0091 0.0110 d1 0.575 0.644 0.714 0.0226 0.0254 0.0281 d2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel 3500 pieces controlling dimension: millimeters package dimensions for cm1220-04cp chip scale package
cm1220 rev. 2 | page 7 of 10 | www.onsemi.com csp tape and reel specifications part number chip size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width w reel diameter qty per reel p 0 p 1 cm1220-04 1.33 x 0.96 x 0.644 1.42 x 1.07 x 0.740 8mm 178mm (7") 3500 4mm 4mm
cm1220 rev.2 | page 8 of 10 | www.onsemi.com CM1220-08CP mechanical specifications package specifications package custom csp bumps 10 millimeters inches dim min nom max min nom max a1 1.915 1.960 2.005 0.0754 0.0772 0.0789 a2 1.285 1.330 1.375 0.0506 0.0524 0.0541 b1 0.495 0.500 0.505 0.0195 0.0197 0.0199 b2 0.245 0.250 0.255 0.0096 0.0098 0.0100 b3 0.430 0.435 0.440 0.0169 0.0171 0.0173 b4 0.430 0.435 0.440 0.0169 0.0171 0.0173 c1 0.180 0.230 0.280 0.0071 0.0091 0.0110 c2 0.180 0.230 0.280 0.0071 0.091 0.0110 d1 0.575 0.644 0.714 0.0226 0.0254 0.0281 d2 0.368 0.419 0.470 0.0145 0.0165 0.0185 # per tape and reel 3500 pieces controlling dimension: millimeters package dimensions for CM1220-08CP chip scale package
cm1220 rev. 2 | page 9 of 10 | www.onsemi.com csp tape and reel specifications part number chip size (mm) pocket size (mm) b 0 x a 0 x k 0 tape width w reel diameter qty per reel p 0 p 1 cm1220-08 1.96 x 1.33 x 0.644 2.08 x 1.45 x 0.740 8mm 178mm (7") 3500 4mm 4mm
cm1220 rev.2 | page 10 of 10 | www.onsemi.com on semiconductor and are registered trademarks of semiconductor componen ts industries, llc (scillc). scillc reserves the ri ght to make changes without further notice to any products herein. scillc makes no warranty, represe ntation or guarantee regarding the suitability of i ts products for any particular purpose, nor does sc illc assume any liability arising out of the application or use of any product or cir cuit, and specifically disclaims any and all liabil ity, including without limitation special, conseque ntial or incidental damages. ?typical? parameters which may be provided in scillc data she ets and/or specifications can and do vary in differ ent applications and actual performance may vary ov er time. all operating parameters, including ?typicals? must be validated for each customer application by customer's technic al experts. scillc does not convey any license und er its patent rights nor the rights of others. scillc products are not designed , intended, or authorized for use as components in systems intended for surgical implant into the body , or other applications intended to support or sustain life, or for any other applicati on in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unau thorized application, buyer shall indemnify and hol d scillc and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and ex penses, and reasonable attorney fees arising out of , directly or indirectly, any claim of personal inj ury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the des ign or manufacture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applic able copyright laws and is not for resale in any ma nner. publication ordering information publication ordering information publication ordering information publication ordering information literature fulfillment literature fulfillment literature fulfillment literature fulfillment : literature distribution center for on semiconductor p.o. box 5163, denver, colorado 80217 usa phone phone phone phone : 303-675-2175 or 800-344-3860 toll free usa/canada fax fax fax fax : 303-675-2176 or 800-344-3867 toll free usa/canada email email email email : orderlit@onsemi.com n. american technical support n. american technical support n. american technical support n. american technical support : 800-282-9855 toll free usa/canada europe, middle east and africa technical europe, middle east and africa technical europe, middle east and africa technical europe, middle east and africa technical support: support: support: support: phone: 421 33 790 2910 japan customer focus center japan customer focus center japan customer focus center japan customer focus center phone: 81-3-5773-3850 on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative
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